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THURSDAY, June 10, 2004, 2:00 PM - 4:00 PM | Room: 6C
TOPIC AREA:  NANOMETER ANALYSIS AND SIMULATION

   SESSION 48
  Interconnect Extraction
  Chair: Yehia Massoud - Rice Univ., Houston, TX
  Organizers: Sachin S. Sapatnekar, Jamil Kawa

  This session presents new developments in the area of 3D parasitic extraction. The first paper performs capacitance extraction under multi-dielectric environments. Next, a parasitic extractor for microelectronics, multichip modules and MEMS which combines the fast multipole method with QR matrix compression is presented. The third paper shows a method for determining inductive noise coupling. A full wave field solver for RF, analog and high-speed digital circuits is presented next. Finally, a presentation on a technique that develops closed-form expressions for distributed RC interconnects rounds out the session.

    48.1   Sparse Transformations and Preconditioners for Hierarchical 3-D Capacitance Extraction with Multiple Dielectrics
  Speaker(s): Shu Yan - Texas A&M Univ., College Station, TX
  Author(s): Shu Yan - Texas A&M Univ., College Station, TX
Vivek Sarin - Texas A&M Univ., College Station, TX
Weiping Shi - Texas A&M Univ., College Station, TX
    48.2A Fast Parasitic Extractor Based on Low Rank Multilevel Matrix Compression for Conductor and Dielectric Modeling in Microelectronics and MEMS
  Speaker(s): Dipanjan Gope - Univ. of Washington, Seattle, WA
  Author(s): Dipanjan Gope - Univ. of Washington, Seattle, WA
Swagato Chakraborty - Univ. of Washington, Seattle, WA
Vikram Jandhyala - Univ. of Washington, Seattle, WA
    48.3CHIME: Coupled Hierarchical Inductance Model Evaluation
  Speaker(s): Satrajit Gupta - Carnegie Mellon Univ., Pittsburgh, PA
  Author(s): Satrajit Gupta - Carnegie Mellon Univ., Pittsburgh, PA
Lawrence T. Pileggi - Carnegie Mellon Univ., Pittsburgh, PA
    48.4sLarge-Scale Full-Wave Simulation
  Speaker(s): Sharad Kapur - Integrand Software, Inc., Hoboken, NJ
  Author(s): Sharad Kapur - Integrand Software, Inc., Hoboken, NJ
David E. Long - Integrand Software, Inc., Hoboken, NJ
    48.5sClosed-Form Expressions of Distributed RLC Interconnects for Analysis of On-Chip Inductance Effects
  Speaker(s): Yuichi Tanji - Kagawa Univ., Takamatsu, Japan
  Author(s): Yuichi Tanji - Kagawa Univ., Takamatsu, Japan
Hideki Asai - Shizuoka Univ., Hamamatsu, Japan